BP

Byung-Iyul Park

Samsung: 1 patents #6,546 of 15,403Top 45%
📍 Seoul, KR: #3,138 of 7,818 inventorsTop 45%
Overall (2018): #467,769 of 503,207Top 95%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10153219 Fan out wafer level package type semiconductor package and package on package type semiconductor package including the same Hyung Jun Jeon, Nae-In Lee 2018-12-11