Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153219 | Fan out wafer level package type semiconductor package and package on package type semiconductor package including the same | Nae-In Lee, Byung-Iyul Park | 2018-12-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153219 | Fan out wafer level package type semiconductor package and package on package type semiconductor package including the same | Nae-In Lee, Byung-Iyul Park | 2018-12-11 |