Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128148 | Methods for fabricating semiconductor devices including surface treatment processes | Viet Ha Nguyen, Nae-In Lee, Thomas Oszinda, Byung-Hee Kim, Jong-Min Baek | 2018-11-13 |
| 10096549 | Semiconductor devices having interconnection structure | Byung-Hee Kim, Thomas Oszinda, Deok-Young Jung, Jong-Min Baek | 2018-10-09 |
| 9929098 | Copper via with barrier layer and cap layer | Sang-Hoon Ahn, Thomas Oszinda, Jong-Min Baek, Byung-Hee Kim, Nae-In Lee +1 more | 2018-03-27 |