Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141233 | Electronic package and fabrication method thereof | Chang-Lun Lu | 2018-11-27 |
| 10128178 | Electronic package and method for fabricating the same | Hung-Yuan Li, Chieh-Lung Lai, Shih-Liang Peng, Chang-Lun Lu | 2018-11-13 |
| 9997481 | Semiconductor package with stacked semiconductor chips | — | 2018-06-12 |
| 9991178 | Interposer and electrical testing method thereof | Chi-Hsin Chiu, Shih-Kuang Chiu | 2018-06-05 |