Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163834 | Chip package structure comprising encapsulant having concave surface | Hung-Hsin Hsu, Nan-Chun Lin, Shang-Yu Chang Chien | 2018-12-25 |
| 9972554 | Wafer level chip scale package having continuous through hole via configuration and fabrication method thereof | Chia-Chang Chang, Hung-Hsin Hsu, Wen-Hsiung Chang, KEE-WEI CHUNG, Chia-Wen Lien | 2018-05-15 |