| 10163737 |
Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages |
Yaojian Lin |
2018-12-25 |
| 10163815 |
Semiconductor device with dummy metal protective structure around semiconductor die for localized planarization of insulating layer |
Yaojian Lin, Xia Feng, Jianmin Fang |
2018-12-25 |
| 10163747 |
Semiconductor device and method of controlling warpage in reconstituted wafer |
Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Seng Guan Chow, Yaojian Lin |
2018-12-25 |
| 10049964 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units |
Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu, Yu Gu |
2018-08-14 |
| 9978654 |
Semiconductor device and method of forming dual-sided interconnect structures in Fo-WLCSP |
Yaojian Lin |
2018-05-22 |
| 9875973 |
Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers |
Yaojian Lin, Yu Gu, Wei Meng, Chee Siang Ong |
2018-01-23 |
| 9865482 |
Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component |
Yaojian Lin, Jianmin Fang, Haijing Cao |
2018-01-09 |
| 9865525 |
Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units |
Yaojian Lin, Pandi C. Marimuthu, Yu Gu |
2018-01-09 |