Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103138 | Dual-sided silicon integrated passive devices | Vidhya Ramachandran, Kunzhong Hu, Mengzhi Pang, Chonghua Zhong | 2018-10-16 |
| 10056327 | SOC with integrated voltage regulator using preformed MIM capacitor wafer | Kunzhong Hu | 2018-08-21 |
| 10056384 | Multi-die fine grain integrated voltage regulation | Jared L. Zerbe, Emerson S. Fang, Shawn Searles | 2018-08-21 |
| 10041847 | Various stress free sensor packages using wafer level supporting die and air gap technique | Caleb C. Han, Tongbi Jiang | 2018-08-07 |
| 9935087 | Three layer stack structure | Kunzhong Hu | 2018-04-03 |
| 9935076 | Structure and method for fabricating a computing system with an integrated voltage regulator module | Vidhya Ramachandran, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more | 2018-04-03 |
| 9883822 | Biometric sensor chip having distributed sensor and control circuitry | Milind S. Bhagavat | 2018-02-06 |