Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10041847 | Various stress free sensor packages using wafer level supporting die and air gap technique | Tongbi Jiang, Jun Zhai | 2018-08-07 | $86,470,000 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10041847 | Various stress free sensor packages using wafer level supporting die and air gap technique | Tongbi Jiang, Jun Zhai | 2018-08-07 | $86,470,000 |