Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103512 | VCSEL structure with embedded heat sink | Weiping Li, Xiaofeng Fan | 2018-10-16 |
| 10083931 | Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same | Young Do Kweon | 2018-09-25 |
| 10041847 | Various stress free sensor packages using wafer level supporting die and air gap technique | Caleb C. Han, Jun Zhai | 2018-08-07 |