Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10026724 | Semiconductor package and method of manufacturing the same | Ji Hwang Kim, Sang-Uk Han, Cha-Jea Jo, Gun-ho Chang | 2018-07-17 |
| 9997446 | Semiconductor package including a rewiring layer with an embedded chip | Ji Hwang Kim, Cha-Jea Jo, Won-Il Lee | 2018-06-12 |
| 9966364 | Semiconductor package and method for fabricating the same | Gun-ho Chang, Cha-Je Jo | 2018-05-08 |
| 9899337 | Semiconductor package and manufacturing method thereof | Gun-ho Chang, Tae-Je Cho | 2018-02-20 |