Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109550 | Wafer-level package with enhanced performance | Julio C. Costa, Jonathan Hale Hammond, Jan Edward Vandemeer, Merrill Albert Hatcher, Jr. | 2018-10-23 |
| 10020206 | Encapsulated dies with enhanced thermal performance | Thomas Scott Morris, David Jandzinski, Stephen Parker, Julio C. Costa | 2018-07-10 |
| 9960145 | Flip chip module with enhanced properties | Julio C. Costa, Thomas Scott Morris, Jonathan Hale Hammond, David Jandzinski, Stephen Parker | 2018-05-01 |