Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10020206 | Encapsulated dies with enhanced thermal performance | Thomas Scott Morris, David Jandzinski, Jon Chadwick, Julio C. Costa | 2018-07-10 |
| 9960145 | Flip chip module with enhanced properties | Julio C. Costa, Thomas Scott Morris, Jonathan Hale Hammond, David Jandzinski, Jon Chadwick | 2018-05-01 |