Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10020206 | Encapsulated dies with enhanced thermal performance | David Jandzinski, Stephen Parker, Jon Chadwick, Julio C. Costa | 2018-07-10 |
| 9960145 | Flip chip module with enhanced properties | Julio C. Costa, Jonathan Hale Hammond, David Jandzinski, Stephen Parker, Jon Chadwick | 2018-05-01 |
| 9942994 | Connection using conductive vias | Ulrik Riis Madsen, Donald Joseph Leahy | 2018-04-10 |
| 9935066 | Semiconductor package having a substrate structure with selective surface finishes | Robert Hartmann | 2018-04-03 |
| 9897512 | Laminate variables measured electrically | David C. Dening, Chris Botzis | 2018-02-20 |