Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109550 | Wafer-level package with enhanced performance | Julio C. Costa, Jonathan Hale Hammond, Jan Edward Vandemeer, Jon Chadwick | 2018-10-23 |
| 10103080 | Thermally enhanced semiconductor package with thermal additive and process for making the same | Julio C. Costa, George Maxim, Dirk Robert Walter Leipold, Baker Scott, Stephen Mobley | 2018-10-16 |