Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163772 | Stacked semiconductor device structure and method | Michael J. Seddon | 2018-12-25 |
| 10115716 | Die bonding to a board | Michael J. Seddon | 2018-10-30 |
| 10115662 | Semiconductor device and method of forming a curved image sensor | Michael J. Seddon, Eric Woolsey | 2018-10-30 |
| 10090233 | Semiconductor device and method of forming micro interconnect structures | Jefferson W. Hall, Michael J. Seddon | 2018-10-02 |
| 10079199 | Through-substrate via structure and method of manufacture | Michael J. Seddon | 2018-09-18 |
| 10014245 | Method for removing material from a substrate using in-situ thickness measurement | Michael J. Seddon | 2018-07-03 |
| 9941257 | Embedded stacked die packages and related methods | Yusheng LIN, Yenting Wen, Chee Hiong CHEW, Azhar Aripin | 2018-04-10 |
| 9935045 | Semiconductor device and method of forming cantilevered protrusion on a semiconductor die | Michael J. Seddon | 2018-04-03 |
| 9893058 | Method of manufacturing a semiconductor device having reduced on-state resistance and structure | Michael J. Seddon | 2018-02-13 |