Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984968 | Semiconductor package and related methods | Yenting Wen, George Chang | 2018-05-29 |
| 9972607 | Semiconductor device and method of integrating power module with interposer and opposing substrates | Jinchang ZHOU, Mingjiao Liu | 2018-05-15 |
| 9941257 | Embedded stacked die packages and related methods | Francis J. Carney, Yenting Wen, Chee Hiong CHEW, Azhar Aripin | 2018-04-10 |
| 9905522 | Semiconductor copper metallization structure and related methods | — | 2018-02-27 |
| 9883595 | Substrate structures and methods of manufacture | Sadamichi Takakusaki | 2018-01-30 |