Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121763 | Clip and related methods | Atapol Prajuckamol, Yushuang YAO | 2018-11-06 |
| 9967986 | Semiconductor package and method therefor | Atapol Prajuckamol, Yushuang YAO | 2018-05-08 |
| 9941257 | Embedded stacked die packages and related methods | Yusheng LIN, Francis J. Carney, Yenting Wen, Azhar Aripin | 2018-04-10 |
| 9911712 | Clip and related methods | Atapol Prajuckamol, Yushuang YAO | 2018-03-06 |