Issued Patents 2018
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163772 | Stacked semiconductor device structure and method | Francis J. Carney | 2018-12-25 |
| 10115716 | Die bonding to a board | Francis J. Carney | 2018-10-30 |
| 10115662 | Semiconductor device and method of forming a curved image sensor | Francis J. Carney, Eric Woolsey | 2018-10-30 |
| 10109475 | Semiconductor wafer and method of reducing wafer thickness with asymmetric edge support ring encompassing wafer scribe mark | — | 2018-10-23 |
| 10096460 | Semiconductor wafer and method of wafer thinning using grinding phase and separation phase | — | 2018-10-09 |
| 10090233 | Semiconductor device and method of forming micro interconnect structures | Francis J. Carney, Jefferson W. Hall | 2018-10-02 |
| 10083868 | Semiconductor die singulation methods | — | 2018-09-25 |
| 10079199 | Through-substrate via structure and method of manufacture | Francis J. Carney | 2018-09-18 |
| 10014245 | Method for removing material from a substrate using in-situ thickness measurement | Francis J. Carney | 2018-07-03 |
| 9991164 | Semiconductor die singulation methods | — | 2018-06-05 |
| 9935045 | Semiconductor device and method of forming cantilevered protrusion on a semiconductor die | Francis J. Carney | 2018-04-03 |
| 9905525 | Semiconductor wafer and method of ball drop on thin wafer with edge support ring | Takashi Noma, Kazuhiro Saito | 2018-02-27 |
| 9893058 | Method of manufacturing a semiconductor device having reduced on-state resistance and structure | Francis J. Carney | 2018-02-13 |