| 10163772 |
Stacked semiconductor device structure and method |
Francis J. Carney |
2018-12-25 |
| 10115716 |
Die bonding to a board |
Francis J. Carney |
2018-10-30 |
| 10115662 |
Semiconductor device and method of forming a curved image sensor |
Francis J. Carney, Eric Woolsey |
2018-10-30 |
| 10109475 |
Semiconductor wafer and method of reducing wafer thickness with asymmetric edge support ring encompassing wafer scribe mark |
— |
2018-10-23 |
| 10096460 |
Semiconductor wafer and method of wafer thinning using grinding phase and separation phase |
— |
2018-10-09 |
| 10090233 |
Semiconductor device and method of forming micro interconnect structures |
Francis J. Carney, Jefferson W. Hall |
2018-10-02 |
| 10083868 |
Semiconductor die singulation methods |
— |
2018-09-25 |
| 10079199 |
Through-substrate via structure and method of manufacture |
Francis J. Carney |
2018-09-18 |
| 10014245 |
Method for removing material from a substrate using in-situ thickness measurement |
Francis J. Carney |
2018-07-03 |
| 9991164 |
Semiconductor die singulation methods |
— |
2018-06-05 |
| 9935045 |
Semiconductor device and method of forming cantilevered protrusion on a semiconductor die |
Francis J. Carney |
2018-04-03 |
| 9905525 |
Semiconductor wafer and method of ball drop on thin wafer with edge support ring |
Takashi Noma, Kazuhiro Saito |
2018-02-27 |
| 9893058 |
Method of manufacturing a semiconductor device having reduced on-state resistance and structure |
Francis J. Carney |
2018-02-13 |