Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141284 | Method of bonding semiconductor substrates | Soon-Wook Kim, Lan Peng, Patrick Verdonck, Robert C. Miller, Gerald Beyer | 2018-11-27 |
| 10066303 | Thin NiB or CoB capping layer for non-noble metallic bonding landing pads | Joeri De Vos, Jaber Derakhshandeh, Luke England, George Vakanas | 2018-09-04 |
| 9978710 | Method for self-aligned solder reflow bonding and devices obtained thereof | Vikas Dubey, Jaber Derakhshandeh | 2018-05-22 |
| 9966325 | Semiconductor die package and method of producing the package | — | 2018-05-08 |
| 9960080 | Method for bonding and interconnecting integrated circuit devices | — | 2018-05-01 |