Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10066303 | Thin NiB or CoB capping layer for non-noble metallic bonding landing pads | Eric Beyne, Joeri De Vos, Luke England, George Vakanas | 2018-09-04 |
| 9978710 | Method for self-aligned solder reflow bonding and devices obtained thereof | Vikas Dubey, Eric Beyne | 2018-05-22 |