LP

Lan Peng

IV Imec Vzw: 1 patents #35 of 173Top 25%
Overall (2018): #332,957 of 503,207Top 70%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10141284 Method of bonding semiconductor substrates Soon-Wook Kim, Patrick Verdonck, Robert C. Miller, Gerald Beyer, Eric Beyne 2018-11-27