Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037940 | Reliable packaging and interconnect structures | Cyprian Emeka Uzoh, Belgacem Haba | 2018-07-31 |
| 10015881 | Cavities containing multi-wiring structures and devices | Cyprian Emeka Uzoh, Belgacem Haba, Ilyas Mohammed | 2018-07-03 |
| 9972582 | Warpage balancing in thin packages | Belgacem Haba, Sangil Lee, Gabriel Z. Guevara, Javier A. Delacruz | 2018-05-15 |
| 9966303 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2018-05-08 |
| 9859220 | Laminated chip having microelectronic element embedded therein | Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Piyush Savalia | 2018-01-02 |