Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032943 | Device layer thin-film transfer to thermally conductive substrate | Bing Dang, John U. Knickerbocker, Steven L. Wright | 2018-07-24 |
| 9947570 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2018-04-17 |
| 9876200 | All-silicon hermetic package and processing for narrow, low-profile microbatteries | Paul S. Andry, Bucknell C. Webb | 2018-01-23 |