Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141286 | Methods of manufacturing semiconductor packages | Won-Il Lee, Ji Hwang Kim | 2018-11-27 |
| 10134702 | Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip | Sun-kyoung Seo, Seung-Kwan Ryu, Tae-Je Cho | 2018-11-20 |
| 10083939 | Semiconductor package | Sun-kyoung Seo, Soo Hyun Ha | 2018-09-25 |
| 10026724 | Semiconductor package and method of manufacturing the same | Ji Hwang Kim, Jong Bo Shim, Sang-Uk Han, Gun-ho Chang | 2018-07-17 |
| 9997446 | Semiconductor package including a rewiring layer with an embedded chip | Ji Hwang Kim, Jong Bo Shim, Won-Il Lee | 2018-06-12 |