Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103134 | Methods of manufacturing multi-die semiconductor device packages and related assemblies | Wei Zhou, Aibin Yu, Zhaohui Ma, Sony Varghese, Jonathan S. Hacker +1 more | 2018-10-16 |
| 10043688 | Method for mount tape die release system for thin die ejection | Jeremy E. Minnich, Brandon P. Wirz, James M. Derderian | 2018-08-07 |
| 9865578 | Methods of manufacturing multi-die semiconductor device packages and related assemblies | Wei Zhou, Aibin Yu, Zhaohui Ma, Sony Varghese, Jonathan S. Hacker +1 more | 2018-01-09 |