Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128214 | Substrate and the method to fabricate thereof | Ming-Chia Wu, Shao-Wei Lu | 2018-11-13 |
| 10063098 | Electronic module and method for forming package | Huei-Ren You, Kaipeng Chiang | 2018-08-28 |
| 10034379 | Stacked electronic structure | Chi-Feng Huang, Da-Jung Chen | 2018-07-24 |
| 9984996 | Three-dimensional (3D) package structure with electronic components encapsulated by a connection structure over an inductor | Ming-Chia Wu, Shao-Wei Lu | 2018-05-29 |
| 9978611 | Stack frame for electrical connections and the method to fabricate thereof | Da-Jung Chen, Yi-Cheng Lin | 2018-05-22 |
| 9911715 | Three-dimensional package structure and the method to fabricate thereof | Ming-Chia Wu, Shao-Wei Lu | 2018-03-06 |
| 9859250 | Substrate and the method to fabricate thereof | Ming-Chia Wu, Shao-Wei Lu | 2018-01-02 |