Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10084389 | Power module | Yiu-Wai Lai | 2018-09-25 |
| 10083925 | Packaging process of electronic component | Qin Cai | 2018-09-25 |
| 10034379 | Stacked electronic structure | Chi-Feng Huang, Bau-Ru Lu | 2018-07-24 |
| 9978611 | Stack frame for electrical connections and the method to fabricate thereof | Bau-Ru Lu, Yi-Cheng Lin | 2018-05-22 |
| 9973104 | Power module | Yiu-Wai Lai | 2018-05-15 |
| 9913380 | Embedded package structure | Yiu-Wai Lai | 2018-03-06 |
| 9906157 | Package assembly | Chad-Yao Tan | 2018-02-27 |
| 9877408 | Package assembly | Chad-Yao Tan | 2018-01-23 |
| 9875977 | Packaging process of electronic component | Qin Cai | 2018-01-23 |
| 9871463 | Power module | Yiu-Wai Lai | 2018-01-16 |