Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128214 | Substrate and the method to fabricate thereof | Bau-Ru Lu, Ming-Chia Wu | 2018-11-13 |
| 9984996 | Three-dimensional (3D) package structure with electronic components encapsulated by a connection structure over an inductor | Bau-Ru Lu, Ming-Chia Wu | 2018-05-29 |
| 9911715 | Three-dimensional package structure and the method to fabricate thereof | Bau-Ru Lu, Ming-Chia Wu | 2018-03-06 |
| 9880252 | Method of calibrating and debugging testing system | Wei-Cheng Ku, Hao Wei, Yu-Tse Wang | 2018-01-30 |
| 9859250 | Substrate and the method to fabricate thereof | Bau-Ru Lu, Ming-Chia Wu | 2018-01-02 |