Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128214 | Substrate and the method to fabricate thereof | Bau-Ru Lu, Shao-Wei Lu | 2018-11-13 |
| 9984996 | Three-dimensional (3D) package structure with electronic components encapsulated by a connection structure over an inductor | Bau-Ru Lu, Shao-Wei Lu | 2018-05-29 |
| 9911715 | Three-dimensional package structure and the method to fabricate thereof | Bau-Ru Lu, Shao-Wei Lu | 2018-03-06 |
| 9859250 | Substrate and the method to fabricate thereof | Bau-Ru Lu, Shao-Wei Lu | 2018-01-02 |