Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128165 | Package with vertically spaced partially encapsulated contact structures | Wolfram Hable, Juergen Hoegerl, Eduard Knauer, Michael Ledutke | 2018-11-13 |
| 9934990 | Method of manufacturing a cooler for semiconductor modules | Inpil Yoo | 2018-04-03 |