WS

Werner Schustereder

Infineon Technologies Ag: 9 patents #17 of 864Top 2%
IA Infineon Technologies Austria Ag: 2 patents #45 of 266Top 20%
Overall (2018): #4,952 of 503,207Top 1%
11
Patents 2018

Issued Patents 2018

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
10128328 Method of manufacturing semiconductor devices and semiconductor device containing hydrogen-related donors Moriz Jelinek, Hans Weber, Hans-Joachim Schulze, Johannes Georg Laven 2018-11-13
10109489 Method for producing a superjunction device Anton Mauder, Hans Weber, Franz Hirler, Johannes Georg Laven, Hans-Joachim Schulze +3 more 2018-10-23
10096677 Methods for forming a semiconductor device and a semiconductor device Moriz Jelinek, Naveen Goud Ganagona, Johannes Georg Laven, Hans-Joachim Schulze 2018-10-09
10083835 Forming electrode trenches by using a directed ion beam and semiconductor device with trench electrode structures Johannes Georg Laven, Anton Mauder, Roland Rupp, Hans-Joachim Schulze 2018-09-25
10074715 Semiconductor wafer, implantation apparatus for implanting protons and method for forming a semiconductor device Hans-Joachim Schulze, Hans Weber 2018-09-11
10037887 Method for implanting ions into a semiconductor substrate and an implantation system Michael Brugger, Moriz Jelinek, Johannes Georg Laven, Hans-Joachim Schulze 2018-07-31
10002930 Forming a contact layer on a semiconductor body Roland Rupp, Jens Peter Konrath, Francisco Javier Santos Rodriguez, Carsten Schaeffer, Hans-Joachim Schulze +1 more 2018-06-19
9972704 Method for forming a semiconductor device and a semiconductor device Moriz Jelinek, Johannes Georg Laven, Helmut Oefner, Hans-Joachim Schulze 2018-05-15
9960044 Semiconductor device and methods for forming a semiconductor device Johannes Georg Laven, Hans-Joachim Schulze 2018-05-01
9934988 Method for processing a silicon wafer Helmut Oefner, Hans-Joachim Schulze, Sandeep Walia 2018-04-03
9859361 SiC-based superjunction semiconductor device Hans-Joachim Schulze, Wolfgang Jantscher, Roland Rupp, Hans Weber 2018-01-02