Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10114069 | Method for electrical testing of a 3-D chip stack | Martin Eckert, Eckhard Kunigkeit, Otto A. Torreiter | 2018-10-30 |
| 10056346 | Chip attach frame | Martin Eckert, Otto A. Torreiter | 2018-08-21 |
| 9977053 | Wafer probe alignment | Joerg G. Appinger, Eberhard Dengler, Roland Dieterle, Martin Eckert, Gabriele Kuczera +2 more | 2018-05-22 |
| 9927463 | Wafer probe alignment | Joerg G. Appinger, Eberhard Dengler, Roland Dieterle, Martin Eckert, Gabriele Kuczera +2 more | 2018-03-27 |
| 9921268 | Auto-alignment of backer plate for direct docking test boards | Eberhard Dengler, Gabriele Kuczera, Eckhard Kunigkeit, Siegfried Tomaschko | 2018-03-20 |
| 9891272 | Module testing utilizing wafer probe test equipment | Martin Eckert, Eckhard Kunigkeit, Christian Zoellin | 2018-02-13 |
| 9885748 | Module testing utilizing wafer probe test equipment | Martin Eckert, Eckhard Kunigkeit, Christian Zoellin | 2018-02-06 |