Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10114069 | Method for electrical testing of a 3-D chip stack | Martin Eckert, Eckhard Kunigkeit, Quintino L. Trianni | 2018-10-30 |
| 10114914 | Layout effect characterization for integrated circuits | Martin Eckert, Thomas Gentner, Jens Kuenzer, Antje Mueller, Thomas Strach | 2018-10-30 |
| 10056346 | Chip attach frame | Martin Eckert, Quintino L. Trianni | 2018-08-21 |
| 9977053 | Wafer probe alignment | Joerg G. Appinger, Eberhard Dengler, Roland Dieterle, Martin Eckert, Gabriele Kuczera +2 more | 2018-05-22 |
| 9927463 | Wafer probe alignment | Joerg G. Appinger, Eberhard Dengler, Roland Dieterle, Martin Eckert, Gabriele Kuczera +2 more | 2018-03-27 |
| 9904748 | Layout effect characterization for integrated circuits | Martin Eckert, Thomas Gentner, Jens Kuenzer, Antje Mueller, Thomas Strach | 2018-02-27 |