| 10109586 |
Semiconductor device interconnect structures formed by metal reflow process |
Chih-Chao Yang |
2018-10-23 |
| 10008421 |
Capacitance monitoring using x-ray diffraction |
Donghun Kang, Kriteshwar K. Kohli, Oh-Jung Kwon, Anita Madan |
2018-06-26 |
| 9997406 |
Columnar interconnects and method of making them |
Chih-Chao Yang |
2018-06-12 |
| 9991214 |
Activating reactions in integrated circuits through electrical discharge |
Cyril Cabral, Jr., Gregory M. Fritz, Kenneth P. Rodbell |
2018-06-05 |
| 9953869 |
Semiconductor device with reduced via resistance |
Chih-Chao Yang |
2018-04-24 |
| 9929092 |
Treating copper interconnects |
Chih-Chao Yang |
2018-03-27 |
| 9875959 |
Forming a stacked capacitor |
Chih-Chao Yang |
2018-01-23 |
| 9870960 |
Capacitance monitoring using X-ray diffraction |
Donghun Kang, Kriteshwar K. Kohli, Oh-Jung Kwon, Anita Madan |
2018-01-16 |
| 9859157 |
Method for forming improved liner layer and semiconductor device including the same |
Chih-Chao Yang |
2018-01-02 |
| 9859160 |
Semiconductor device with reduced via resistance |
Chih-Chao Yang |
2018-01-02 |
