Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10155886 | Polishing liquid for CMP, and polishing method | Munehiro Oota, Toshio Takizawa, Hisataka Minami, Toshiaki Akutsu | 2018-12-18 |
| 10131819 | Slurry, polishing solution set, polishing solution, and substrate polishing method | — | 2018-11-20 |
| 10030172 | Abrasive, abrasive set, and method for polishing substrate | Hisataka Minami, Toshiaki Akutsu | 2018-07-24 |
| 9988573 | Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate | Takenori Narita, Daisuke Ryuzaki | 2018-06-05 |
| 9982177 | Slurry, polishing fluid set, polishing fluid, and substrate polishing method using same | Hirotaka Akimoto, Takenori Narita, Tadahiro Kimura, Daisuke Ryuzaki | 2018-05-29 |
| 9932497 | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate | Hisataka Minami, Toshiaki Akutsu, Koji Fujisaki | 2018-04-03 |
| 9881801 | Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate | — | 2018-01-30 |
| 9881802 | Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate | — | 2018-01-30 |