Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10155886 | Polishing liquid for CMP, and polishing method | Munehiro Oota, Toshio Takizawa, Toshiaki Akutsu, Tomohiro Iwano | 2018-12-18 |
| 10030172 | Abrasive, abrasive set, and method for polishing substrate | Tomohiro Iwano, Toshiaki Akutsu | 2018-07-24 |
| 9932497 | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate | Tomohiro Iwano, Toshiaki Akutsu, Koji Fujisaki | 2018-04-03 |