Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056381 | Punchthrough stop layers for fin-type field-effect transistors | Ryan Sporer, Amy L. Child | 2018-08-21 |
| 10050119 | Method for late differential SOI thinning for improved FDSOI performance and HCI optimization | Dina H. Triyoso, Ryan Sporer | 2018-08-14 |
| 10043893 | Post gate silicon germanium channel condensation and method for producing the same | Ryan Sporer, Timothy J. McArdle, Judson R. Holt | 2018-08-07 |
| 10020307 | Integrated circuit structure including laterally recessed source/drain epitaxial region and method of forming same | Judson R. Holt, Christopher D. Sheraw, Timothy J. McArdle, Matthew W. Stoker, Mira Park +1 more | 2018-07-10 |
| 10008576 | Epi facet height uniformity improvement for FDSOI technologies | Xusheng Wu | 2018-06-26 |
| 9917103 | Diffusion break forming after source/drain forming and related IC structure | Jin Z. Wallner | 2018-03-13 |