Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121706 | Semiconductor structure including two-dimensional and three-dimensional bonding materials | Rinus Tek Po Lee, Bharat Krishnan, Hui Zang | 2018-11-06 |
| 10020307 | Integrated circuit structure including laterally recessed source/drain epitaxial region and method of forming same | Judson R. Holt, Christopher D. Sheraw, Timothy J. McArdle, Mira Park, George R. Mulfinger +1 more | 2018-07-10 |