Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997445 | Substrate interconnections for packaged semiconductor device | Kai Yun Yow, Bihua He, Navas Khan Oratti Kalandar, Lan Chu Tan, Yuan Zang | 2018-06-12 |
| 9978669 | Packaged semiconductor device having a lead frame and inner and outer leads and method for forming | — | 2018-05-22 |
| 9935079 | Laser sintered interconnections between die | Trent S. Uehling, Leo M. Higgins, III | 2018-04-03 |