Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037965 | Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material | — | 2018-07-31 |
| 9935079 | Laser sintered interconnections between die | Chee Seng Foong, Trent S. Uehling | 2018-04-03 |
| 9899290 | Methods for manufacturing a packaged device with an extended structure for forming an opening in the encapsulant | — | 2018-02-20 |