Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037935 | Lead frame with dummy leads for burr mitigation during encapsulation | Xingshou Pang, Zhigang Bai, Jinzhong Yao | 2018-07-31 |
| 9997445 | Substrate interconnections for packaged semiconductor device | Kai Yun Yow, Chee Seng Foong, Bihua He, Navas Khan Oratti Kalandar, Lan Chu Tan | 2018-06-12 |