Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997445 | Substrate interconnections for packaged semiconductor device | Kai Yun Yow, Chee Seng Foong, Bihua He, Lan Chu Tan, Yuan Zang | 2018-06-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997445 | Substrate interconnections for packaged semiconductor device | Kai Yun Yow, Chee Seng Foong, Bihua He, Lan Chu Tan, Yuan Zang | 2018-06-12 |