Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847256 | Methods for forming a device having a capped through-substrate via structure | Yung-Chi Lin, Yen-Hung Chen, Ebin Liao, Ku-Feng Yang, Tsang-Jiuh Wu +1 more | 2017-12-19 |
YC
Yin Chen
Overall (2017): #189,813 of 506,227Top 40%
1
Patents 2017