Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799529 | Method of planarizing a film layer | Ru-Gun Liu, Wei-Liang Lin, Hsin-Chih Chen | 2017-10-24 |
| 9793211 | Dual power structure with connection pins | Shih-Wei Peng, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +3 more | 2017-10-17 |
| 9754881 | Designed-based interconnect structure in semiconductor structure | Chih-Liang Chen, Chih-Ming Lai, Kam-Tou Sio, Tsong-Hua Ou, Chun-Kuang Chen +3 more | 2017-09-05 |
| 9698048 | Method of fabricating semiconductor device | — | 2017-07-04 |
| 9613850 | Lithographic technique for feature cut by line-end shrink | Chun-Kuang Chen, Ko-Bin Kao, Ken-Hsien Hsieh, Ru-Gun Liu | 2017-04-04 |
| 9543165 | Method of fabricating semiconductor device | — | 2017-01-10 |