Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837353 | Middle end-of-line strap for standard cell | Meng-Hung Shen, Chih-Liang Chen, Jiann-Tyng Tzeng, Kam-Tou Sio, Wei-Cheng Lin | 2017-12-05 |
| 9793211 | Dual power structure with connection pins | Shih-Wei Peng, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Jiann-Tyng Tzeng +3 more | 2017-10-17 |
| 9754881 | Designed-based interconnect structure in semiconductor structure | Chih-Liang Chen, Chih-Ming Lai, Yung-Sung Yen, Kam-Tou Sio, Tsong-Hua Ou +3 more | 2017-09-05 |
| 9741654 | Integrated circuit having slot via and method of forming the same | Wei-Cheng Lin, Jiann-Tyng Tzeng, Praneeth Narayanasetti | 2017-08-22 |
| 9679994 | High fin cut fabrication process | L. C. Chou, Chih-Liang Chen, Chih-Ming Lai, Chin-Yuan Tseng, Jiann-Tyng Tzeng +3 more | 2017-06-13 |
| 9659115 | Thermal analysis for tiered semiconductor structure | Chih-Liang Chen, Jiann-Tyng Tzeng, Shu-Hui Sung | 2017-05-23 |