Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754881 | Designed-based interconnect structure in semiconductor structure | Chih-Liang Chen, Chih-Ming Lai, Yung-Sung Yen, Kam-Tou Sio, Tsong-Hua Ou +3 more | 2017-09-05 |
| 9659115 | Thermal analysis for tiered semiconductor structure | Chih-Liang Chen, Jiann-Tyng Tzeng, Charles Chew-Yuen Young | 2017-05-23 |