Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9663854 | High-throughput system and method for post-implantation single wafer warm-up | Cheng-Hung Hu, Yi-Hann Chen, Kang Hua Chang, Ming-Te Chen | 2017-05-30 |
| 9634126 | Formation of high quality Fin in 3D structure by way of two-step implantation | Chun-Feng Nieh, Hsin-Wei Wu, Yu-Chang Lin | 2017-04-25 |