Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9634126 | Formation of high quality Fin in 3D structure by way of two-step implantation | Chun-Feng Nieh, Tsun-Jen Chan, Yu-Chang Lin | 2017-04-25 |
HW
Hsin-Wei Wu
Overall (2017): #397,592 of 506,227Top 80%
1
Patents 2017