Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9663854 | High-throughput system and method for post-implantation single wafer warm-up | Tsun-Jen Chan, Cheng-Hung Hu, Kang Hua Chang, Ming-Te Chen | 2017-05-30 |
YC
Yi-Hann Chen
Overall (2017): #189,786 of 506,227Top 40%
1
Patents 2017