Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9553043 | Interconnect structure having smaller transition layer via | Lee-Chung Lu, Wen-Hao Chen, Yuan-Te Hou, Fang-Yu Fan, Yu-Hsiang Kao +2 more | 2017-01-24 |
| 9543193 | Non-hierarchical metal layers for integrated circuits | Lee-Chung Lu, Yuan-Te Hou, Li-Chun Tien, Dian-Hau Chen | 2017-01-10 |